Thermal management

Brazed Microchannel Cold Plates.

Microchannel flow plates, covers and fins must maintain geometry and sealing after their joining process.

The challenge

Softening and fine-feature distortion during high-temperature joining can affect pressure drop and sealing.

High-Conductivity Copper for Thermal Management

A high-conductivity material option designed for evaluation in brazed microchannel cooling assemblies.

Alumina Dispersion-Strengthened Copper

High-conductivity ODS copper grade for electrical, thermal and brazed-component evaluation.

CuwayAuric has brochure reference values; compare samples under the same joining cycle and measure the finished cold plate.