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Thermal copper

CuwayAuric High-Conductivity Copper for Thermal Management

A high-conductivity material option designed for evaluation in brazed microchannel cooling assemblies.

Microchannel cold platesBrazingThermal managementPrice on request
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CuwayAuric High-Conductivity Copper for Thermal Management

Illustrative image, not an actual product photo.

Reference values: Brochure-reported typical values: 380–390 W/(m·K), 97–98% IACS, softening temperature ≥850°C. These are not guaranteed assembly results.

Technical data

Physical properties

PropertySI
Electrical conductivity97–98 % IACS
Thermal conductivity380–390 W/(m·K)
Reported softening temperature≥850 °C
Tensile strength at 500°C180–240 MPa
Thermal expansion (25–500°C)16.5–17.5 ×10⁻⁶/K

Product forms

Blocks, Cold-plate components

Made to order / stock on inquiry · Price on request

Typical applications

  • Flow-channel plates, cover plates and microfins
  • AI computing liquid-cooling cold plates under qualification
  • Thermal management assemblies requiring high-temperature joining

Selection checklist

  • Validate channel geometry, fin height and flatness after the planned joining cycle.
  • Measure sealing, leakage, pressure drop, thermal resistance and thermal cycling.
  • Qualify against oxygen-free copper in the same design and process.

Take these parameters to your enquiry

The enquiry form will carry this grade automatically.

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